LG's 2.6MW CDU Sets Cooling Benchmark as NVIDIA Qualification Portfolio Grows
LG's 2.6MW CDU earns NVIDIA DSX Ready qualification, with 600kW and 1MW units also qualified. Explore LG's direct-to-chip liquid cooling for AI data center
Research Desk
LG Electronics has positioned its liquid cooling technology at the center of its data center strategy, with the company confirming that its Coolant Distribution Units (CDUs) have achieved qualification under NVIDIA's DSX Ready program.
The qualification covers the company's 2.6-megawatt (MW) CDU, which LG identifies as carrying the largest cooling capacity of any DSX Ready CDU partner, a claim the company says is based on the listing time shown on the NVIDIA marketplace.
The CDUs use a direct-to-chip (DTC) liquid cooling approach, delivering coolant straight to the CPU, GPU and other heat-generating components. According to LG, the units are designed to work alongside existing air-cooling infrastructure, forming a hybrid cooling system capable of managing the thermal demands of AI facilities.
The company frames its data center solutions as something to be integrated during the early stages of facility planning, providing a basis for designing cooling systems and supporting infrastructure that meet the power and thermal requirements of next-generation AI factories.
Qualifications Span Three Capacity Classes
Beyond the flagship 2.6 MW unit, LG has completed infrastructure qualification for both its 600 kW and 1 MW CDUs. Those qualifications required the company to satisfy technical criteria spanning cooling performance, failover capabilities, and reliability. LG says the qualifications demonstrate its expertise in liquid cooling across multiple stages of high-density AI infrastructure and underscore the efficiency and reliability of its liquid cooling solutions for global hyperscalers.
Partner Network Membership Announced from Seoul
Alongside the qualification news, LG announced on September 28, 2026, that it has joined the NVIDIA Partner Network (NPN) as a Power and Cooling Solution Preferred Partner. The announcement, made from Seoul, reinforces the company's position in thermal management for high-density AI data centers at a time when rising thermal loads are demanding greater cooling efficiency.
James Lee, president of the LG ES Company, described the membership as a strategic milestone. "Joining the NVIDIA Partner Network as a Power and Cooling Preferred Partner is a pivotal step in our strategy to support the expansion of the global AI ecosystem," Lee said.
"Together with NVIDIA, LG will help shape the future of AI data centers by delivering advanced cooling solutions that address the industry's most critical thermal challenges." The announcement was published under LG's Eco Solution news category, where the company also drew attention to related data center cooling work, including the 2.6MW CDU qualification and the launch of an air-cooled centrifugal chiller for AI data centers.
Singapore Showcase Follows Partnership News
The qualified CDUs are on display at Data Centre World Asia 2026 (DCWA 2026), taking place September 29–30 at Marina Bay Sands in Singapore. The showcase comes immediately after the partnership announcement, giving LG a platform to present the units that have completed NVIDIA AI infrastructure qualification to an industry audience.
4.0MW Model Slated for Qualification Push
Looking ahead, LG plans to pursue NVIDIA qualification for its 4.0MW CDU model by the end of this year. The company describes the planned qualification as reinforcing the quality of its expanding portfolio of liquid cooling solutions intended for next-generation AI data centers.
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