Sparxity to Bring Energy-Efficient AI Chips into T-Systems Data Centers from 2028
Sparxity and T-Systems sign Letter of Intent to deploy energy-efficient AI chips in European data centers from 2028, boosting sovereign AI infrastructure.
Research Desk
Dresden-based AI hardware developer Sparxity, formerly known as SpiNNcloud Systems GmbH, and T-Systems have signed a Letter of Intent to develop energy-efficient AI computing infrastructure in Europe.
Agreement Sealed at Federal Digital Summit
The agreement was concluded at the German Federal Government's Digital Summit and is intended to pair Sparxity's sparse-native computing technology with T-Systems' data center infrastructure and operational expertise.
The signing brought together Karsten Wildberger, Federal Minister for Digital Transformation and Government Modernisation, Hector A. Gonzalez, co-founder and CEO of Sparxity, and Ferri Abolhassan, CEO of T-Systems. Deutsche Telekom, T-Systems' parent company, is using the deal to broaden its AI partner ecosystem.
How the Technology Is Meant to Cut AI Power Consumption
Sparxity builds full-stack systems for fine-grained, dynamic sparsity, from custom chips to software, under the principle of computing "only what matters." According to the company, models have long been shaped by the dense hardware they run on, and its hardware is designed to direct computing power exactly where it is needed, allowing intelligence to scale without sacrificing speed or efficiency.
CEO Hector A. Gonzalez said the technology concentrates computing power only where it is needed, making AI more energy-efficient and scalable. He noted that the current generation of Sparxity systems is already deployed in rack- and supercomputer-scale installations across Europe and the United States, and said the company sees great potential in working with T-Systems to bring its next-generation chip into datacenter deployments.
Roadmap for the Next-Generation Chip
Under the initial phase of the cooperation, Sparxity's current hardware will be used to develop approaches for the technical integration of the next generation of its chips in data centers.
The first deployment is targeted for 2028, combined with T-Systems' data center infrastructure and partner ecosystem. Building on that first step, the companies plan to develop high-performance, energy-efficient AI computing systems for future applications and optimize them for specific use cases. Detailed terms of the collaboration are to be negotiated in the coming months.
Government Backing for Technological Independence
Federal Minister Karsten Wildberger welcomed the cooperation as evidence of Germany's capacity for technological independence. "The project shows that digital sovereignty is feasible in Germany, if we combine our own technological expertise with efficient infrastructure and strong partners," Wildberger said. He added that the Digital Summit provides important impetus for such cooperation and brings together the players shaping Germany's digital future.
T-Systems Anchors the Deal in Its Munich AI Factory
Ferri Abolhassan, who is also a Member of the Board of Management of Deutsche Telekom AG, placed the partnership in the context of Europe's demand for economically viable AI infrastructure.
"Germany and Europe need a powerful AI infrastructure that can be operated and scaled economically," Abolhassan said. He cited the T Cloud portfolio and the company's AI factory in Munich as the basis for this, said T-Systems remains open to further partners, and looked forward to having Sparxity on board in its AI factory soon, noting the German company performs particularly well on the energy-efficient use of AI computing power.
Next Steps in the Partnership
The LoI is positioned as a contribution to Europe's sovereign AI infrastructure by combining Sparxity's energy-efficient chips and computing systems with T-Systems' data center operations and its Munich AI factory.
The next milestone is the detailed collaboration agreement, which the companies plan to negotiate in the coming months, with a targeted first deployment of the next-generation Sparxity chips in 2028.
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